Our Force/Strengths
Remotely Generated Plasma:
We have independent control of all process parameters including target voltage and ion current
Low Temperature Process:
Low temperature deposition for plastic or other 'delicate' substrates
Stable High Rate Reactive Process:
Virtual elimination of target poisoning since the surface of the target is uniformly eroded.
Stress Control:
Due to our unique process we are able to control the stress if growing thin films from compressive through to tensile.
Potential for Multilayer Devices:
PQL systems have the ability to deposit multilayer without breaking vacuum
Thick ferromagnetic targets:
Ability to sputter from thick ferromagnetic targets
Substrate plasma-cleaning:
Offering enhanced adhesion performance
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Alternative process from wet chemical coatings |
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Coating by wet processes such as electroplating is becoming increasingly less acceptable. PQL’s sputter deposition technology offers an attractive alternative, with commercial benefits having already been demonstrated.
Film densities are substantially higher than can be achieved through wet processing
Adhesion is significantly greater
The required thicknesses of the deposited films can be thinner.
The number of process operations such as post deposition annealing is reduced, leading to higher yields.
As an example, chromium and gold films sputtered onto molybdenum discs out performed electroplated devices, and were significantly better than films deposited from conventional PVD systems.
Coating by wet processes such as electroplating is becoming increasingly less acceptable. PQL’s sputter deposition technology offers an attractive alternative, with commercial benefits having already been demonstrated.
- Film densities are substantially higher than can be achieved through wet processing
- Adhesion is significantly greater
- The required thicknesses of the deposited films can be thinner
- The number of process operations such as post deposition annealing is reduced, leading to higher yields.
As an example, chromium and gold films sputtered onto molybdenum discs out performed electroplated devices, and were significantly better than films deposited from conventional PVD systems.
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Strategic Materials
Metals:
Ag, Al, Au, Bi, Co, Cr, Cu, Fe, Hf, In, Mg, Mn, Mo, Nb, Ni, Pb, Pt, Sn, Ta, Ti, W, Y, Zn, Zr
Dielectrics:
AlN, Al2O3, PbO, SiO2, Ta2O5, NbO5, TiO2, TixO2x-1, TiN, HfO2, CuO, In2O3, MgO
(Oxy-Nitrides and sub-oxides are also possible with PQL technology)
Transparent conducting oxides:
Sn:InO (ITO), In:ZnO(IZO), Al:ZnO (AZO), ZnO
Magnetic materials:
Co, CoFe, Fe, NiFe
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