Our Force/Strengths

Remotely Generated Plasma:

We have independent control of all process parameters including target voltage and ion current

Low Temperature Process:

Low temperature deposition for plastic or other 'delicate' substrates

Stable High Rate Reactive Process:

Virtual elimination of target poisoning since the surface of the target is uniformly eroded.

Stress Control:

Due to our unique process we are able to control the stress if growing thin films from compressive through to tensile.

Potential for Multilayer Devices:

PQL systems have the ability to deposit multilayer without breaking vacuum

Thick ferromagnetic targets:

Ability to sputter from thick ferromagnetic targets

Substrate plasma-cleaning:

Offering enhanced adhesion performance

HiTUS in action

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Optical Filters PDF Print E-mail
PQL’s system allows accurate deposition of optical multi-layer stacks
Film properties are maintained at varied deposition rates
The process is very stable and is repeatable run to run
Dielectrics are reactively sputtered from metallic targets in most cases, leading to the densification of the deposited films
SiO2 Ta2O5 Nb2O5 TiO2 are some of the materials we have sputtered
Expensive feedback control is not necessary.
PQL's system uses a multiple target holder which provides the capability to repeatedly and reliably deposit identical alternating layers of differing materials. Coupled with a menu driven PLC, one touch batch process control is easily achieved.

PQL’s system allows accurate deposition of optical multi-layer stacks.

  • Film properties are maintained at varied deposition rates
  • The process is very stable and is repeatable run to run
  • Dielectrics are reactively sputtered from metallic targets in most cases, leading to the densification of the deposited films
  • SiO2 Ta2O5 Nb2O5 TiO2 are some of the materials we have sputtered
  • Expensive feedback control is not necessary.

PQL's system uses a multiple target holder which provides the capability to repeatedly and reliably deposit identical alternating layers of differing materials. Coupled with a menu driven PLC, one touch batch process control is easily achieved.
 

Strategic Materials

Metals:

Ag, Al, Au, Bi, Co, Cr, Cu, Fe, Hf, In, Mg, Mn, Mo, Nb, Ni, Pb, Pt, Sn, Ta, Ti, W, Y, Zn, Zr

Dielectrics:

AlN, Al2O3, PbO, SiO2, Ta2O5, NbO5, TiO2, TixO2x-1, TiN, HfO2, CuO, In2O3, MgO

(Oxy-Nitrides and sub-oxides are also possible with PQL technology)

Transparent conducting oxides:

Sn:InO (ITO), In:ZnO(IZO), Al:ZnO (AZO), ZnO

Magnetic materials:

Co, CoFe, Fe, NiFe