Our Force/Strengths
Remotely Generated Plasma:
We have independent control of all process parameters including target voltage and ion current
Low Temperature Process:
Low temperature deposition for plastic or other 'delicate' substrates
Stable High Rate Reactive Process:
Virtual elimination of target poisoning since the surface of the target is uniformly eroded.
Stress Control:
Due to our unique process we are able to control the stress if growing thin films from compressive through to tensile.
Potential for Multilayer Devices:
PQL systems have the ability to deposit multilayer without breaking vacuum
Thick ferromagnetic targets:
Ability to sputter from thick ferromagnetic targets
Substrate plasma-cleaning:
Offering enhanced adhesion performance
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Thin films of alumina (Al2O3) have been deposited using the proprietary Plasma Quest Ltd sputter deposition technology. Exceptional deposition rates and optical transmission are achieved by using a highly stable reactive deposition process. All the film characterisation has been corroborated by independent measurements made by customers and collaborators. PQL would welcome the opportunity to coat Alumina on to any customer substrate including glass, silicon wafers and numerous plastics.
Benefits include:
Very high deposition rate of High quality alumina
RI very near to bulk properties
High electrical breakdown capability
Very low stress films (controlled through process conditions)
Deposition onto plastic and delicate substrates
Also low rate deposition
Waveguide material
UV stable
Thin films of alumina (Al2O3) have been deposited using the proprietary Plasma Quest Ltd sputter deposition technology. Exceptional deposition rates and optical transmission are achieved by using a highly stable reactive deposition process. All the film characterisation has been corroborated by independent measurements made by customers and collaborators. PQL would welcome the opportunity to coat Alumina on to any customer substrate including glass, silicon wafers and numerous plastics.
Benefits include:
- Very high deposition rate of High quality alumina
- RI very near to bulk properties
- High electrical breakdown capability
- Very low stress films (controlled through process conditions)
- Deposition onto plastic and delicate substrates
- Also low rate deposition
- Waveguide material
- UV stable
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Strategic Materials
Metals:
Ag, Al, Au, Bi, Co, Cr, Cu, Fe, Hf, In, Mg, Mn, Mo, Nb, Ni, Pb, Pt, Sn, Ta, Ti, W, Y, Zn, Zr
Dielectrics:
AlN, Al2O3, PbO, SiO2, Ta2O5, NbO5, TiO2, TixO2x-1, TiN, HfO2, CuO, In2O3, MgO
(Oxy-Nitrides and sub-oxides are also possible with PQL technology)
Transparent conducting oxides:
Sn:InO (ITO), In:ZnO(IZO), Al:ZnO (AZO), ZnO
Magnetic materials:
Co, CoFe, Fe, NiFe
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