Remotely Generated Plasma:
We have independent control of all process parameters including target voltage and ion current
Low Temperature Process:
Low temperature deposition for plastic or other 'delicate' substrates
Stable High Rate Reactive Process:
Virtual elimination of target poisoning since the surface of the target is uniformly eroded.
Due to our unique process we are able to control the stress if growing thin films from compressive through to tensile.
Potential for Multilayer Devices:
PQL systems have the ability to deposit multilayer without breaking vacuum
Thick ferromagnetic targets:
Ability to sputter from thick ferromagnetic targets
Offering enhanced adhesion performance
Through its unique HiTUS sputter deposition process, PQL is a solution provider to the thin film industry in general, but especially when more conventional processes are not capable of achieving the desired film properties. As such, there are occasions when PQL will work with OEMs of these conventional systems to enable the final Client to achieve its goals.
In order to secure business that would otherwise not be achieved, vacuum equipment manufacturers that supply standard systems eg magnetron, may wish to avail themselves of the PQL technology for incorporation or retrofitting into their systems. In such cases PQL is prepared to negotiate a license deal for each Plasma Launch System (PLS) either supplied or as fabricated by the OEM. Due to the unique nature of the HiTUS process PQL will, if requested, work closely with the OEM both at the design stage and at the process stage, to ensure that the system meets the Client’s requirements.
At this stage the license arrangement is not available for the linear target technology.
It should be recognised that HiTUS systems, whilst appearing simple in construction, have complex process technologies underpinning them. It is this process expertise that enables PQL to offer its Clients a significantly enhanced product than if the Client chooses to attempt a system build.
Notwithstanding this, PQL does supply the Plasma Launch System (PLS) which is the heart of the technology as a stand alone “component” for integration into a Client’s vacuum chamber. In such instances PQL will work closely with the Client to maximise the opportunity to have a successful system build.
It should also be noted that the final COST of such a chosen route may well be higher than the purchase of a full system as designed and supplied by PQL.
Ag, Al, Au, Bi, Co, Cr, Cu, Fe, Hf, In, Mg, Mn, Mo, Nb, Ni, Pb, Pt, Sn, Ta, Ti, W, Y, Zn, Zr
AlN, Al2O3, PbO, SiO2, Ta2O5, NbO5, TiO2, TixO2x-1, TiN, HfO2, CuO, In2O3, MgO
(Oxy-Nitrides and sub-oxides are also possible with PQL technology)
Transparent conducting oxides:
Sn:InO (ITO), In:ZnO(IZO), Al:ZnO (AZO), ZnO
Co, CoFe, Fe, NiFe