Our Force/Strengths
Remotely Generated Plasma:
We have independent control of all process parameters including target voltage and ion current
Low Temperature Process:
Low temperature deposition for plastic or other 'delicate' substrates
Stable High Rate Reactive Process:
Virtual elimination of target poisoning since the surface of the target is uniformly eroded.
Stress Control:
Due to our unique process we are able to control the stress if growing thin films from compressive through to tensile.
Potential for Multilayer Devices:
PQL systems have the ability to deposit multilayer without breaking vacuum
Thick ferromagnetic targets:
Ability to sputter from thick ferromagnetic targets
Substrate plasma-cleaning:
Offering enhanced adhesion performance
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Sidearm Plasma Launch Systems (PLS) |
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PQL's sidearm technology can be purchased for integration or retro-fit with client's vacuum deposition system. Contact PQL to learn how integrating our technology with your existing sputtering deposition system will improve processes such as metal and dielectric sputtering; reactive sputter coating; Plasma etch; PECVD.
The Plasma Launch System is available with 100mm and 150mm plasma launch tube.
PQL's sidearm technology can be purchased for integration or retro-fit with client's vacuum deposition system. Contact PQL to learn how integrating our technology with your existing sputtering deposition system will improve processes such as metal and dielectric sputtering; reactive sputter coating; Plasma etch; PECVD.
The Plasma Launch System is available with 100mm and 150mm plasma launch tube.
Upgrades:
It should be recognised that HiTUS systems, whilst appearing simple in construction, have complex process technologies underpinning them. It is this process expertise that enables PQL to offer its Clients a significantly enhanced product than if the Client chooses to attempt a system build.
Notwithstanding this, PQL does supply the Plasma Launch System (PLS) which is the heart of the technology as a stand alone “component” for integration into a Client’s vacuum chamber. In such instances PQL will work closely with the Client to maximise the opportunity to have a successful system build.
It should also be noted that the final COST of such a chosen route may well be higher than the purchase of a full upgrade as designed and supplied by PQL.
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Strategic Materials
Metals:
Ag, Al, Au, Bi, Co, Cr, Cu, Fe, Hf, In, Mg, Mn, Mo, Nb, Ni, Pb, Pt, Sn, Ta, Ti, W, Y, Zn, Zr
Dielectrics:
AlN, Al2O3, PbO, SiO2, Ta2O5, NbO5, TiO2, TixO2x-1, TiN, HfO2, CuO, In2O3, MgO
(Oxy-Nitrides and sub-oxides are also possible with PQL technology)
Transparent conducting oxides:
Sn:InO (ITO), In:ZnO(IZO), Al:ZnO (AZO), ZnO
Magnetic materials:
Co, CoFe, Fe, NiFe
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