Remotely Generated Plasma:
We have independent control of all process parameters including target voltage and ion current
Low Temperature Process:
Low temperature deposition for plastic or other 'delicate' substrates
Stable High Rate Reactive Process:
Virtual elimination of target poisoning since the surface of the target is uniformly eroded.
Due to our unique process we are able to control the stress if growing thin films from compressive through to tensile.
Potential for Multilayer Devices:
PQL systems have the ability to deposit multilayer without breaking vacuum
Thick ferromagnetic targets:
Ability to sputter from thick ferromagnetic targets
Offering enhanced adhesion performance